記憶產品代工服務
12" DRAM Wafer Fabrication Service
| Wafer Size |
Process |
Technology |
Type |
Status* |
| 300mm |
Trench DRAM |
90nm |
Commodity |
P |
| LP |
| 300mm |
Stack DRAM |
65nm |
Commodity |
P |
| LP |
UD | * Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life.
Contact us:
Foundry@winbond.com
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