Winbond - 同步動態隨機存取記憶體
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同步動態隨機存取記憶體

Synchronous DRAM is designed to process data at the same clock speed as the CPU. Therefore, synchronous DRAM is regarded as the core component that is used in high speed processing of large volumes of data. Currently, its usage is expanding to various consumer electronics such as DTV, DSC, HDD and STB.

16Mb SDRAM
Part No. Organization Speed Grade Voltage Package Status* RoHS
W9816G6IH 1Mx16 2 Banks -5 143 MHz CL2

3.3V±0.3V

Package in TSOP II 50-pin, 400 mil using Pb free with RoHS compliant P Y
200 MHz CL3
-6/-6I 166 MHz 3.3V±0.3V
-7/-7I 143 MHz 2.7V~3.6V
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life. 

64Mb SDRAM

Part No. Organization Speed Grade Voltage Package Status* RoHS
W9864G2GH 2Mx32 4 Banks -5 200 MHz CL3 3.3V±0.3V

Packaged in TSOP II 86-pin (400 mil) using Pb free with RoHS compliant

N Y
-6/-6I 166 MHz
-7  143 MHz 2.7V~3.6V
W9864G6IH 4Mx16 4 Banks -5

200 MHz

CL3 3.3V±0.3V Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant P Y
-6/-6I 166 MHz
-7/-7S 143 MHz 2.7V~3.6V
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life, N= None for new design.

128Mb SDRAM

Part No. Organization Speed Grade Voltage Package Status* RoHS
W9812G2IH 4Mx32 4 Banks -6/-6I 166 MHz CL3 3.3V±0.3V

Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant

P Y
-75 133 MHz
W9812G2IB 4Mx32 4 Banks -6/-6I 166 MHz CL3 3.3V±0.3V

Packaged in TFBGA 90 ball(8x13mm² ), using Lead free materials with RoHS compliant

P Y
-75 133 MHz
W9812G6IH 8Mx16 4 Banks -5 200 MHz CL3 3.3V±0.3V

TSOP II 54-pin, 400 mil using Pb free with RoHS compliant

P Y
-6/-6I 166 MHz
-75 133 MHz
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life.

256Mb SDRAM

Part No. Organization Speed Grade Voltage Package Status* RoHS
W9825G2DB 8Mx32 4 Banks -6/-6I 166 MHz CL3 3.3V±0.3V

TFBGA 90 ball using Pb free with RoHS compliant

P Y
-75/75I 133 MHz
W9825G6EH 16Mx16 4 Banks -5 200MHz CL3

3.3V±0.3V

Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant P Y
-6/-6I 166 MHz
-6 133 MHz CL2
-75/75I CL3
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life.

Contact us:  SDRAM@winbond.com