Overview

Winbond Electronics Corp. was founded in September 1987 in Hsinchu Science Park, Taiwan and has been publicly traded on the Taiwan Stock Exchange since 1995. In October 2008, the headquarter is relocated to Central Taiwan Science Park where the newly built 300mm wafer fab. The site is mainly focusing on research & development and production, of which the process technology covers from 0.11μm~70nm.

Today, Winbond focuses on the Memory Products design and manufacturing with three main business groups—DRAM Product Business Group, Memory IC Manufacturing Business Group, and Flash Memory IC Business Group. The DRAM products have made significant advances in the mobile memory market. Winbond’s Low Power DRAM is designed to meet the need of portable multimedia devices for high-performance memory with low power consumption. In addition, the high performance and reliability of our SDRAM and Pseudo SRAM products have been well received by our customers.

As to Memory IC Manufacturing products, Winbond has obtained the latest technologies continuously through good collaborations with international partners. Winbond has been implementing the advanced process technologies acquired through its Commodity DRAM foundry service to the manufacturing of its in-house products of Specialty DRAM, Mobile Memory, and Flash Memory, and achieving the best cost structure for company’s growth and profits. Our flash Memory is dedicated to low and medium density NOR Flash memory products. The complete product allocations on both Parallel Flash and Serial Flash along with the development of manufacturing process make the flash products more competitive in the market.

To maintain its long-term relationships with its customers and strengthen regional supports, Winbond has set up subsidiaries in the USA, Japan, and Hong Kong. Winbond, with the collaboration of its experienced and intelligent team, owns abundant and highly graded patents worldwide. Professionalism and innovation are the main goals that we continue pursuing. In order to improve the yield rates, supply chain management, and customer satisfaction, Winbond implements a high standard manufacturing process control and quality control system, and thereby has been accredited by IECQ, ISO 9001, ISO 14001 and QS 9000.

Integrated with innovation of technology, the corporate values of Winbond Accountability, Innovation, and Teamwork, have been deeply rooted in all aspects of operational activities to achieve company’s objectives. With its specialty on IC design, Winbond will endeavor to improve every aspect of daily life for people and bring new thoughts and new life to the society.