Memory IC Manufacture Business Group

Products and Prospects

Low Power SDRAM Manufacture

Pseudo SRAM Manufacture

Specialty DRAM Manufacture

Flash Manufacture

DDRⅡ Manufacture

For many years, Winbond has been devoted to manufacturing Memory ICs. We continually develop and improve the Low-Power production process with the help of our current DRAM process technology. Our 12-inch fab, located in Central Taiwan Science Park (Taichung), is our base of operation.

Module A, in our 12-inch wafer fab, has reached full capacity and we have started to expand the equipment in Module B. The process technology has been successfully transferred from 110 nm to 75 nm. The mass production of 75 nm migration is on scheduled and the process technology is going to step to 65 nm.

Competitive Advantage

Winbond’s 12-inch fab in Taichung continues to lead in advanced production technologies, and offers our customers a complete service.

The baseline process technology, based on trench capacitors, was acquired from Infineon and has been improved by our dedicated team for use in Low Power DRAM production. Afterward Winbond Electronics Corporation and Qimonda AG announced signing a new agreement for 75nm DRAM trench technology transfer and production capacity collaboration. For pursuing further advanced production technologies, Winbond has announced signing a new agreement with Qimonda AG for 65nm Buried Wordline DRAM technology transfer recently. This will also reinforce Winbond’s Mobile Memory Solutions in the future.

Winbond has top-rate process technologies and a fully automatic wafer fab. Recently, we have invested in upgrading technologies and enlarging our capacity. Our customers are located throughout Taiwan, mainland China, Japan, Europe and America.

Do you want to work in the world's foremost 12-inch fab and become an expert in advanced process technologies? Joining Winbond Memory IC Manufacture Business Group is your best choice.More Product Information

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