Winbond - Memory Product Foundry
Home \\ Product & Sales \ Product Lines \ Memory Product Foundry Service \ Memory Product Foundry

Memory Product Foundry

12" DRAM Wafer Fabrication Service

Wafer Size Process Technology Type Status*
300mm Trench DRAM 90nm Commodity P
LP
300mm Stack DRAM 65nm Commodity P
LP UD
* Status: P= Mass Production, S=Samples, UD=Under Development, UD (Time)= Under Development(Ready Time), EOL=End of life.

 

Contact us:  Foundry@winbond.com