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Winbond Electronics has launched the new W25Q-RV series 3V NOR Flash, which exceeds JEDEC standards and has passed 105°C cycling and retention tests for high reliability. The product supports 2.7–3.6V, with densities from 1Mb to 32Mb, making it suitable for various applications. The RV series offers Dual/Quad I/O SPI interfaces, up to 133MHz clock, and achieves up to 84MB/s transfer rate in QPI+DTR mode. Its high read speed enables direct code execution or faster boot times. Programming and erase operations are faster, with tPP, tSE, and tBE reduced to 0.25ms, 30ms, and 120ms, improving productivity and reducing costs. It also minimizes OTA downtime and enhances user experience. For densities below 32Mb, an XSON8 2x3 package is available for space-constrained designs. With its own fabs, Winbond Electronics ensures high quality and long-term supply, empowering developers to create next-generation IoT applications.