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Winbond SLC NAND Flash Product Brief

Product Brief
W29N08GV, W29N04GV, W29N02GV, W29N02KV, W29N01HV, W29N08GW/Z, W29N04GW/Z, W29N04KW/Z, W29N02GW/Z, W29N02KW/Z, W29N01HW/Z, SLC, NAND, Flash, W29N
  • File Type：PDF
  • Updated：Tue Oct 14 15:04:19 CST 2025
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Winbond QspiNAND Flash Product Brief

Product Brief
QspiNAND, Serial, NAND, Flash, W25N, W25N512GV, W25N01KV, W25N01GV, W25N02KV, W25N04KV, W25N512GW, W25N01GW, W25N02KW, W25N04KW
  • File Type：PDF
  • Updated：Wed Mar 19 14:52:22 CST 2025
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Winbond SpiStack Flash Product Brief

Product Brief
W25M02GVxxAG, W25M02GVxxAT, W25M321AVxIT, W25M321AWxIT, W25M512JVxIQ, W25M512JWxIQ, W25Q01JVxxIQ/M, W25Q01NWxxIQ/M, W25Q02JVTBIM, W25Q02NWTBIM, SpiStack, W25M, stackingdies, smallformfactor, smallform, continuousread, SPI, 8pin
  • File Type：PDF
  • Updated：Thu Sep 12 11:21:20 CST 2024
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Winbond has unveiled its latest 1Gb QspiNAND Flash for wearable and low-power IoT devices

Product Press
The W25N01KW flash memory stands out for its high-speed read capabilities, achieving speeds up to 52MB/sec in both Continuous Read and Sequential Read modes. The fast boot and instant-on support enhance energy efficiency and extend the devices' operational lifespan. It also offers an advanced deep power-down mode that reduces power consumption to as low as 1µA. The W25N01KW comes in a small form factor and is available in compact WSON8 (8mm x 6mm) and WSON8 (6mm x 5mm) packages. These exceptional features ensure ultra-fast code/data access, longer battery life, and compact design, contributing to an optimized user experience across various applications.
QspiNAND, low-power, IoT, 1Gb, W25N01KW

Winbond introduces the next generation 8Mb Serial Flash – W25Q80RV for low power and small form factor IoT devices

Product Press
As IoT devices become widely deployed in industrial factory automation and smart home control applications combining processing, connectivity, and sensor technologies in a system that is small and upgradeable, the demand grows for flash memories that come in small-form-factor packaging, consume a negligible amount of energy, and support fast software updates. The W25Q80RV is manufactured in Winbond’s own 12-inch wafer foundry utilizing the latest generation of Winbond’s 58nm technology. The die area is reduced by 40% compared to its predecessor which was built with 90nm technology.
W25Q80RV, 8Mb_Serial_Flash, low_power, IoT, KGD
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