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New 1.2V, 1.5V Devices Feature Small 8-Pin Packages SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – June 29, 2017 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced a dramatic expansion of its flash product portfolio with the introduction of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-first-very-low-voltage-flash.html?__locale=en

https://www.winbond.com/productResource-files/Winbond 1.2V Serial Flash Product Brief_EN_20250226.pdf

2Gb NAND + 1Gb LPDDR2 Features W29N02GZ NAND Flash Memory • Basic Features – Density : 2Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x8 – Operating temperature Industrial: -40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 2G-bit/256M-byte – Page size 2,...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW20GF3FW.html?__locale=en

1Gb NAND + 512Mb LPDDR2 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x8 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GE3FW.html?__locale=en

New W25Q64NE 1.2V SpiFlash IC provides the higher capacity needed by a new generation of wireless consumer devices such as True Wireless earbuds and fitness wristbands TAICHUNG, Taiwan– 2022-03-16 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today a...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_extends_64Mb_1.2V_SPI_NOR_Flash_storage_capacity.html?__locale=en

1Gb NAND + 1Gb LPDDR2 Features W29N01GZ NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : X8 – Operating temperature Industrial: -40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size:2,...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GF3FW.html?__locale=en

1Gb NAND + 1Gb LPDDR2 Features W29N01GW NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x16 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page size:...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GF1EW.html?__locale=en

1Gb NAND + 512Mb LPDDR2 Features W29N01GW NAND Flash Memory • Basic Features – Density : 1Gbit (Single chip solution) – Vcc : 1.7V to 1.95V – Bus width : x16 – Operating temperature Industrial: - 40°C to 85°C • Single-Level Cell (SLC) technology. • Organization – Density: 1G-bit/128M-byte – Page siz...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GE1EW.html?__locale=en

Industry’s vision for the Internet of Things (IoT) foresees the installation of billions of devices connected to the world’s universal network. All forecasts for the numbers of IoT nodes are huge. Simple mathematical reasoning suggests that the average production cost per node must be small, otherwi...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-efficient-memory-solutions-can-help-designers-of-iot-nodes-meet-tight-bom-cost-targets.html?__locale=en

Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-keys-to-successful-adoption-of-new-low-voltage-memory.html?__locale=en