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https://www.winbond.com/productResource-files/Winbond_Specialty_DRAM_Mobile_DRAM_Product Brief_2023Q1.pdf

Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=en

(Taipei)-- Winbond Electronics Corporation announced today that it is joining with Toshiba Corporation, Japan to co-develop 0.13 micron trench type DRAM memory technology and 512M DRAMs. This is the first joint DRAM process technology development project between Winbond and Toshiba, following a seri...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00005.html?__locale=en

From these recent two year, IoT has changed from analyzing information from endpoint sensor or edge device to providing an on-time inference. This transformation, so call AIoT, can reduce the system response time and overall system power consumption. It is already applied on smart speaker, smart doo...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00002.html?__locale=en

Tokyo, Japan and Taichung, Taiwan, November 11, – Elpida Memory, Inc. (Tokyo: 6665), Japan’s leading global supplier of Dynamic Random Access Memory (DRAM), and Winbond Electronics Corp. today announced that they have signed a Memorandum of Understanding (MOU) for DRAM foundry services that will see...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00061.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/GP-Boost-DRAM-for-AI-Applications

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-unveils-256mb-low-power-dram.html?__locale=en

https://www.winbond.com/productResource-files/DA05-0015A1.pdf

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

(Taipei News) Winbond Electronics Corporation today announced the signing of a Memorandum of Understanding (MOU) with Infineon Technologies AG for 0.11-micron DRAM technology. It is the first technology agreement between the two companies. Under the terms of the MOU, Winbond will manufacture commodi...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00025.html?__locale=en

(Taipei News) Fujitsu Limited, Toshiba Corporation and Winbond Electronics Corp. today announced that Winbond will join their collaborative development program for next-generation memory devices. Begun in January 1999, the 30-plus-billion-yen project has pursued development of 0.13ľm DRAM technology...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00004.html?__locale=en

(Taipei news) Winbond Electronics Corporation Board of Directors today approved a proposal to enter product transfer and technology licensing agreement with Qimonda AG for Graphic DRAM business that uses Graphic Double Data Rate (GDDR) specification. The plan is to acquire Qimonda’s GDDR-related pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00059.html?__locale=en

(Taipei News) Winbond Electronics Corporation today announced an update on its corporate DRAM business strategy and disclosed new construction plans for its new 12-Inch fab. Pursuant to the Company's strategic DRAM business strategy, the Company's DRAM partner, Toshiba Corporation Japan, is in the p...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00018.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-GAA107_1.html&level=1